Abstract
This paper focuses on multi-physics modeling of encapsulating gels in power electronic modules for transient and steady-state simulation. With the emergence of wide-bandgap semiconductors such as SiC or GaN, operating at a higher temperature than conventional Si power chips, this passive element of the packaging appears as a few studied element sensitive to thermal and mechanical stresses. A thermo-mechanical coupled modeling of the material, based on bond graph representation, is presented. This approach allows to establish, under the same formalism, an analogy between the different physical domains. From this analogy, a multi-physical nonlinear state space representation is built, allowing transient simulation of the thermo-mechanical behavior of the material. This way of modeling and simulating is particularly adapted for a preliminary study during the upstream phases of design of the power electronic modules. It quickly establishes the maximum temperature and mechanical strains experienced by the gel.
Highlights
Wide-bandgap semiconductor materials (SiC, GaN,...) are able to operate at higher temperature ranges than traditional silicon chips
The proposed modeling method is based on the analogy of physical domains in terms of power transfers formalized by the bond graph [13,14,15]
A thermo-mechanical modeling approach was presented for the simulation of a few studied material used in power electronic modules: the silicone gel used for encapsulation
Summary
Wide-bandgap semiconductor materials (SiC, GaN,...) are able to operate at higher temperature ranges than traditional silicon chips Their use allows to increase power densities within the power modules with more integrated structures and functions [1,2,3,4,5]. The modeling methodology proposed in this paper, based on the bond graph representation, leads to establish a nonlinear multi-physics state space representation of the system in order to simulate thermo-mechanical behavior of the gel with a satisfactory accuracy.
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