Boiling heat transfer to helium from a surface covered with corrugate mesh

Abstract

Heat transfer characteristics of a surface having a new structure are measured. A mesh plate with a corrugation of 1–2 mm height and 0.6–1 mm pitch is soldered to the flat copper surface. The experimental results from this surface show a significant enhancement of heat flux in the film boiling regime. The heat flux increases up to 11 times that of the flat surface in this regime. The new structure is effective for the stabilization of superconductors-having such high critical temperatures as Nb 3Sn etc.