Abstract

The boiling heat transfer from copper surface oriented vertically to liquid helium was investigated. The surface conditions had significant effects on the boiling heat transfer of liquid helium. The surface roughness, the surface history and the surface-fluid interface phenomena were discussed. Although the surface roughness showed a small effect in the nucleate boiling region, the peak flux did not change. The surfaces with various chemical films produced lower heat transfer coefficients in the nucleating boiling region, but they increased the minimum film boiling heat flux qmin. For the surface polished #600 emery paper, there was the much enormous hysteresis in the nucleate boiling heat transfer.

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