BN green gel thermal interface material with high thermal conductivity and low thermal contact resistance for efficiently thermal management

Abstract

As an important component of electronic devices, thermal interface materials (TIMs) provide a fast heat dissipation channel, which will significantly improve the reliability and long-term stability of electronic devices. Gel TIMs with good flexibility is a development direction for thermal management in the future. However, the green and environmental issues in the preparation of gel TIMs with good stability are also important problems that must be considered. Here, combining the advantages of green deep eutectics solvents and high thermal conductivity boron nitride, a boron nitride polymerizable deep eutectics solvents gel composite TIMs with high thermal conductivity, good stability and low thermal contact resistance (TCR) has been developed. The thermal conductivity of composite TIMs achieved 1.18 W/m·K at a boron nitride loading of 20 wt%. Under pressure gradient testing (10 Psi-50 Psi), the TCR of composite TIMs decreased to 0.76 K·cm2/W. In the temperature gradient test (30 °C-70 °C), the TCR of the composite TIMs dropped to 0.143 K·cm2/W. Furthermore, in the TCR cycling test, the composites showed better cycling stability. In addition, composite TIMs also show better thermal performance in practical applications. This work provides a green way for the fabrication of gel TIMs with high thermal conductivity, good stability and low TCR.