Block Thermal Model for High Power Lidded Packages

Abstract

This paper proposes a new approach, block thermal model, by characterizing detailed thermal model in the end-use application environment, including thermal solution interface with package lid. The resulting block thermal model would accurately capture the interface heat transfer between package lid and external thermal solution, containing no proprietary information regarding die or package. The procedure of constructing a block thermal model from detailed thermal model is described.As part of this study, several block thermal models were validated in end-use applications against detailed thermal models, with varying TIM2 and Heatsink assumptions for high power lidded packages. Results showed that the junction temperatures predictions from block thermal models were in very good agreement with those from detailed thermal model simulations, demonstrating that block thermal model can accurately represent detailed thermal model in terms of junction temperature for end-use applications. Data from such verification simulations is discussed in detail.