Blasting to the Substrate of Various Temperatures

Abstract

Blasting is a substrate processing technique during which spherical or granular materials made of metal or ceramics are jetted against the substrate surface using compressed air. The high speed colliding of blasting materials against the surface produces a peening effect. The purpose of blasting is to create a clean substrate surface. However, there are almost no investigations that consider the influence of the substrate temperature. The object of this investigation is to clarify the influence of substrate temperature on blasting. Results of this investigation are summarized as follows: in spite of the substrate material, the removal rate was the smallest at 260∼270 K. Influence of substrate temperature on the removal rate of an Al substrate is larger than that of other substrates. Influence of substrate temperature on arc height is large when higher than the room temperature. Influence of substrate temperature on arc height of an Al substrate is larger than that of other substrates. As hardness HV value increases, arc height becomes large. Even if the substrate temperature changes, an Am substrate can be used as a standard substrate for the blasting process.