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Abstract
In this research, we optimized both the molecular and crosslinked structures of epoxy resin to achieve exceptional breakdown strength and a competitive glass transition temperature (Tg). Through simulations, we found that the epoxy molecule with a polymerization degree of 0 (Ep0) exhibited a wider bandgap (Eg) and developed a dense crosslinked structure with higher density after crosslinking. This countered the negative impact of a reduced benzene structure, enhancing molecular rigidity and improving Tg. We isolated Ep0 components and prepared samples demonstrating a significant 22.18 % increase in breakdown strength (366.39 kV/mm vs. 299.87 kV/mm for commercial EP) and a Tg of 140.91 °C. The superior insulation properties of our product stem from its higher Eg molecular structure, while the competitive Tg is attributed to its compact crosslinked structure and increased density.
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