Abstract
There was a sudden increase of intermetallic compound (IMC) Cu 6Sn 5 growth rate in the eutectic Sn58wt. %Bi/Cu joint during aging process. With aging time increasing, Bi accumulated at the Cu 3Sn/Cu interface and gradually induced the fracture mode of the joint to change from ductile to brittle one along this interface. Bi segregation enhanced IMC Cu 6Sn 5 growth by means of promoting the interfacial reaction at Cu 3Sn/Cu interface, which was concluded from IMCs (Cu 6Sn 5 and Cu 3Sn) growth behavior for pure Sn/Cu and Sn10wt. %Bi/Cu interconnects at the same temperature.
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