Abstract
AbstractAn approach to realize the reinforcement of a thermoset system at the molecular level by rigid‐rod polymers was investigated. A mixture of bisbenzocyclobutene (BCB)‐terminated imide oligomers constitutes the thermosetting component, and the rigid‐rod polymer utilized in the present study was poly(p‐phenylene benzothiazole) (PBT). The cure chemistry of the thermoset materials is based on the ability of benzocyclobutene functions to homopolymerize under the influence of heat. Thermal properties as well as film processing and mechanical properties of PBT/BCB thermoset composites are presented.
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