Bionanoelectronics Platform with DNA Molecular Wires Attached to High Aspect-Ratio 3D Metal Microelectrodes

Abstract

In this study, the investigation of attachment of DNA molecular wires and ropes to high aspect-ratio three-dimensional (3D) metal microelectrodes and their subsequent electrical characterization as part of a bionanoelectronics platform is reported. The 3-D microelectrode architecture consists of mainly high aspect-ratio microelectrode structures (75 μm height and above) patterned from relatively thick layers of negative tone photoresist and covered by sputtered gold on their top surface. DNA attachments on 3-D microelectrode structures was demonstrated using oligonucleotide-DNA self-assembly and thiol-gold covalent bonding. Further, DC and AC electrical characterization of double-stranded λ-DNA molecular wires in a dry environment and suspended between high aspect-ratio 3D microelectrodes 75 μm away from the substrate (to heights unprecedented so far in the literature which thereby eliminate interference of substrate) is presented. Electrical characterizations based on I-V and AC impedance analysis of several repeatable data points of attachment with varying λ-DNA concentration (500 ng/μL to 1.5 ng/μL) showed measurable and significant conductivity of λ-DNA molecular wires with some band-gap; thereby establishing it as semi-conductor at low-frequencies (<100 Hz) and a very good conductor at high-frequencies (∼1 MHz). We believe that the research presented here represents a significant departure from previous studies and makes unique contributions through (i) more accurate direct conductivity measurement of DNA molecular wires facilitated by suspension of the DNA away from the substrate, and (ii) AC impedance measurement of DNA molecular wires in dry-state attachment (relevant for long-term viability studies) that suggest metal-type low impedance at high-frequencies. The significant conductivity of λ-DNA molecular wires (similar to metals) observed at high-frequencies (|Z| < 5 KΩ) opens up substantial opportunities.