Abstract
In this brief, we investigate device variability in advanced fin field effect transistor (FinFET) static random access memory (SRAM) devices (12 and 7 nm) as a function of drain-to-source (Vds) bias. Drain-induced barrier lowering (DIBL) and the variation in DIBL are found to exhibit a logarithmic dependence with drain bias in the advanced node FinFET devices. Correctly capturing the DIBL and device variation as a function of drain bias is required, as the SRAM operation voltage range is expanded. We show the improved hardware correlation in Vmin yield and the improved slow corner read performance when the Vds-dependent variation is considered.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.