Abstract
We have developed a novel packaging tool-set of 13 machines to support continuous manufacturing process from a half-inch wafer process line until ready to be used. The packaging tools are made under minimal fab standard so that a half-inch wafer can be attached on a metal-substrate without dicing. The method that we employed is a BGA (Ball Grid Array)-type solder array which consists of following processes; a compression molding, a laser via, a copper redistribution layer (RDL) patterning, a solder-ball mounting, and a reflow. The development of each machine process and the total packaging process integration has been carried out. In this paper, we introduce a BGA packaging result using only our newly developed tools.
Published Version
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