Beyond Thermal Limits in Computer Systems Cooling

Abstract

This lecture will explore the thermal limits in Computer Systems Cooling with the aid of a “thermal design space.” First, future trends in computer technologies are stated and thermal implications are discussed. “Thermally friendly” approaches to some of the visionary computer-“wear” of the next century are suggested. Then, building on the material that will be lectured at the Institute, the practical thermal limits in convection, conduction and boiling schemes are examined. As an example, the extensions of conduction thermal limits are illustrated by a discussion of the evolution of the early IBM TCM, Thermal Conduction Module, to the present TCM. Suggestions are made in the use of heat pipes to circumvent some of the limits associated with boiling and immersion cooling. Finally, the origins of thermal limits are linked to the packing limits in computer packaging and the need for extending those limits are discussed.