(Best Paper Award, Invited) Manufacturing of Nanosheets and Multilayer Nanogaps in Silicon

Abstract

Nanogap technology is the basic concept for many promising devices such as localized SOI, multichannel FETs, and resonant tunneling diodes.It will be shown that intrinsic bulk strain in single crystalline silicon can be used to create homogeneous nanogaps with a few nanometer gap distance. The strain has been created by epitaxial growth of Si1-xGex/Si multi-layer stacks on 200 mm (100) silicon wafers. The stacks were patterned by RIE to reveal the side walls for subsequent lateral etching with gaseous hydrochloric acid. In accordance with former investigations [1] we found that a selectivity up to 1000:1 for Si1-xGex/Si can be achieved for Ge-concentrations >30% and growth temperatures T<650°C. XRD measurements, SEM pictures and wagon wheel test structures prove that for the anisotropic lateral etching behavior intrinsic strain is the dominant factor. Furthermore, the crystal orientation plays a dominant role (Fig. 1). Based on this behavior multilayer nanogaps with spacings <10 nm had been fabricated.In a subsequent process nanogaps down to 5 nm have been successfully filled completely with dielectrics and/or metals by low temperature (T<450°C) plasma oxidation, LPCVD as well as ALD (Fig. 2). The resulting nanosheets can be used for device applications.Vertical diodes and lateral MOS transistors with nanogaps and nanosheets have been fabricated. Diodes with a SiO2 gap filling show perfect Fowler-Nordheim tunneling, which proves the high quality of the gap filling process. The electrical properties of nanogap-MOSFETs and various nanogap-diodes will be presented.[1] Destefanis et al., Semiconductor Sci. Technol. 23, 1 (2008) Fig. 1: Wagon wheel structure showing the etch anisotropy of 8 nm SiGe layer in Si Fig. 2: SEM cross section of a multistack of 6 SiGe layers selectively etched and completely filled with LPCVD oxide