Berry wax improves the physico-mechanical, thermal, water barrier properties and biodegradable potential of chitosan food packaging film

Abstract

Chitosan (CT) is extensively applied in developing food packaging films due to its non-toxic, biodegradable, and good film-forming properties. But CT-based single polymer film has issues with poor physico-mechanical, thermal, and light barrier properties. Therefore, this study aimed to incorporate natural berry wax (BYW) at various concentrations (5 %, 10 %, 15 %, 20 %, and 25 %, wt%) into CT to improve the quality characteristics of CT film. The microstructure of the film matrix was effectively proven to be compatible with BYW through the utilization of SEM, XRD, and FTIR spectroscopy. The results demonstrated that the quality parameters of CT/BYW composite film were significantly affected by the increasing concentration of BYW. The integration of BYW with a concentration of 5 % to 20 % to CT substantially improved the film characteristics by reducing moisture content, swelling power, solubility, and water vapor permeability, increasing the film’s opacity, thermal stability, and tensile strength as well as enhancing the biodegradable potential. Furthermore, CT/BYW films showed higher thermal stability and UV and visible light resistance compared to pure CT film. Taken together, the CT film with 20 % berry wax showed the best film characteristics and biodegradable potential, which could be promising for enhancing the shelf-life of various food products.