Abstract
Beryllium oxide (BeO)-filled epoxy composite was prepared and used as a thermal interface material (TIM) in light-emitting diode (LED) packages. The filler percentages influenced on changing thermal and optical behaviour of LED at various driving currents. An improvement of 14.36% in thermal conductivity was recorded from that of neat epoxy. The lowest total thermal resistance of 10.75 K/W ( Rth) and rise in junction temperature ( Tj) of 3.1°C were recorded at 100 mA driving current for 50 wt-% BeO-filled TIM attached LED followed by an improved optical output and lowered correlated colour temperature values (3466 K). Thermal imaging infra-red imaging analysis also supported the observation of reduced Tj and Rth values from transient analysis and indicated lower chip surface temperature ( Ts) at all driving currents.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
