Bending stress relaxation of microscale single-crystal copper at room temperature: An in situ SEM study

Abstract

The bending stress relaxation of microscale single-crystal copper was studied by in situ SEM bending experiments to elucidate the time-dependent plasticity involving the effect of the strain gradient and the sample size. Three specimens with varied heights of square cross sections were fabricated using a focused ion beam. Interestingly, an obvious bending plateau was observed in the load-displacement curves. The calculated flow stress on the cross section indicated an inverse relationship between the specimen size and strength. In addition, the proportion of decay stress is approximately 2.7% for the beam with a height of h = 1.82 μm and 13.9% for that of h = 0.94 μm in the bending plateau. Moreover, during the dwell period, a sudden stress drop occurred, which is ascribed to the strain burst or stress jerky during the deformation of single-crystal metals. Microbending is usually related to a significant increase in geometrically necessary dislocations (GNDs), which is supposed to improve the resistance for further deformation. However, the bending plateau implied perfect plastic flow and an evolving balance in the microstructures. On the other hand, thermal activation theory was employed to interpret the time-dependent plasticity. The apparent activation volume of the dwell periods in the bending plateau suggested that cross slip dominates the inelastic strain rate evolution. Finally, the inelastic strain rate for stress relaxation was derived from the curve of decay stress, and it was inversely proportional to the height of the microbeam, which is in complete contrast with the trend observed in the previous compression tests of micropillars. In current microscale bending specimens, the thinner beam containing fewer initial dislocation sources exhibits a larger creep ductility with the assistance of GNDs.