Abstract
Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.
Highlights
The market for flexible electronics is growing steadily [1,2,3]
Ultra-thin chips are very common in flexible electronics and need to be strong enough to withstand the tension that occurs during production and handling [12]
The full understanding of the mechanical stability of the individual components of a stress and achievable bending radii is of great relevance, since this information is the key to flexible system enables the development of reliable applications
Summary
The market for flexible electronics is growing steadily [1,2,3]. Reasons for the growing numbers of flexible electronics used include mechanical flexibility, high scalability, low weight, and, last but not least, large-area production compatibility [4,5,6]. Ultra-thin chips are very common in flexible electronics and need to be strong enough to withstand the tension that occurs during production and handling [12] The integration of these ultra-thin and bendable integrated circuits in roll-to-roll processes enables the development of cheap, mechanically flexible electronics. To make these systems reliable, detailed investigations of both the strength and the deformation of the layers of thin components. The mechanical reliability of these flexible nents This failure is mainly caused by the forces generated due to bending or vibration of electronics is very important to ensure the growing market demand for those systems.
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