Bending of nanowire–flexible substrate assemblies integrated via direct synthesis methods

Abstract

AbstractNanowires are successfully synthesized directly onto two types of flexible substrates, Kapton and silicone. Reduced temperature catalyst‐assisted chemical vapor deposition techniques enable the direct integration. The mechanical properties of these assemblies are evaluated using bending tests where tensile or compressive strains are applied to the samples. Substrate‐dependent nanowire properties, thin film formation, and failure of the integrated assemblies are observed. magnified image Image: Failure of a germanium nanowire (GeNW) array synthesized on a flexible substrate once subjected to compressive strains.