Abstract
Directional solidification experiments have been conducted to document SiC particle behavior at the solid-liquid interface in Al-2 pct Mg (cellular interface) and Al-6.1 pct Ni (eutectic interface) alloys. Particle size ranged from 20 to 150 μm diameter. Although predictions based on the thermodynamic approach suggest that no engulfment is possible, it was demonstrated that particles can be entrapped in the solid if adequate solidification rates and temperature gradients are used. The main factors responsible for this behavior are considered to be the difference between the thermal conductivities of particles and metal, the buildup of volume fraction of particles at the interface, and the morphological instability of the interface induced by the particles. A model including the contribution of drag and thermal conductivity has been proposed. Calculation with this model produced numbers for the critical velocity slightly higher than those evaluated experimentally. Various factors which can account for this discrepancy are discussed.
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