Abstract
We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 <TEX>${\mu}m$</TEX>, a width of 200 <TEX>${\mu}m$</TEX>, a thickness of 10 <TEX>${\mu}m$</TEX>, and a pitch of 650 <TEX>${\mu}m$</TEX> for <TEX>$11{\times}11$</TEX> BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.
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