Abstract
Fabrication of thin-film recording heads with 30-μm wide gaps in 25-μm thick Permalloy have been reported previously. Formation of narrow gaps by chemical etching was limited by undercutting. This paper describes a process for fabricating thin-film recording heads with gaps 2 μm wide in Permalloy film which is 2.5 μm thick. The process makes use of electroplating, photoetching, and electron beam technologies. The narrow gaps with vertical walls are made possible by the use of electron sensitive resist, electron beam exposure of 2-μm wide strips, and electroplating of 2.5-μm thick films of Permalloy on each side of the narrow strip of the electron sensitive resist.
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