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Abstract
The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature
Published Version
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