Abstract

III-N materials, especially ternary and quaternary alloys, are profoundly affected by barrier height inhomogeneity as evidenced by great variability in reported barrier height and Richardson constant values for Schottky diode samples involving epilayers with identical material composition. Research into AlInGaN-based devices is gaining traction due to its usefulness for strain engineering, polarization engineering, and vertical device design. Thus it is important to characterize the Schottky barrier height between AlInGaN and technologically relevant metals like nickel. It is proposed that alloy composition fluctuations inherent to low-temperature III-N alloys result in a Schottky barrier height inhomogeneity, and that the Schottky barrier height follows a Gaussian distribution. Current vs voltage data as a function of temperature was measured for three AlInGaN samples of varying composition. Utilizing a model tailored to thermionic emission over a Gaussian distribution of barriers, both the average barrier height and the standard deviation in the distribution were extracted from experimental data via multiple linear regression. Average barrier height was found to correlate with the AlInGaN band gap, while the standard deviation in barrier height increased with aluminum and indium concentration on the group-III sublattice.

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