Abstract
The aim of the research was the problem of damage accumulation for solder alloys used in microelectronics packaging due to creep and fatigue as a result of a combined profile of loading conditions. The selected failure modes affect the lifetime of contemporary electronic equipment. So far the research activities are focused on a single failure mode and the problem of their interaction is often omitted. Taking into account the failure modes interaction would allow more precise lifetime prediction of the contemporary electronic equipment and/or would allow for reduction of time required for reliability tests. Within the taken research framework the reliability analysis of solder joints was conducted for the Sn63Pb37 solder alloy using the Hot Bump Pull method. The results of the presented research contain: reliability tests, statistical analysis and the problem of a damage accumulation due to a combined profile of loading conditions.
Highlights
Electronics is one of the quickest developing discipline of contemporary science and engineering
The special term microelectronics was established among professionals
It is estimated that about 65% of damages in microelectronics packaging is associated to thermomechanical problems [2, 38]
Summary
Electronics is one of the quickest developing discipline of contemporary science and engineering. Taking into account both the solder joint dimensions and different loading conditions of electronic components it came out that reliability prediction methods used in macro scale are not appropriate for micro scale [36] For this reason, it is necessary to develop, on the one hand, advanced measurement techniques, typical for microelectronic technologies, while on the other hand, advanced methods of predicting failures due to thermomechanical loads [25]. The goal of the research was to run a series of experimental strength tests of solder joints used in microelectronic packaging due to a combined loading profile This allowed for analysis of typical failure modes, as creep and fatigue and their interaction phenomenon. The periodically changed force applied to the solder joint allowed observation of both elastic and inelastic displacements
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