Abstract
Cerium oxide (CeO_2) abrasives are conventionally used for polishing process of hard-brittle materials, such as crystal and a glass FPD panel. However, the process with cerium oxide abrasives has some problems (1) hard to invade polishing fluid to the center of workpiece in case of large sized panel during processing and (2) hard to cleaning the surface of workpiece after processing and this causes the high processing cost. In order to solve these problems, an abrasive-free pad etching process of glass mirror polishing has proposed for the purpose of replacement of the cerium oxide abrasives. As the result of a series of pad etching tests on the glass workpieces, we have obtained high removal rate and the surface roughness of under 20nm Ra.
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