Abstract
Micro cutting of sapphire is presented to finish crack-free surfaces in planing and milling. m crystal plane is cut with measuring the cutting force and observing the surface finish in planing. The cutting force depends on the cutting direction and anisotropy is observed in the critical depth of cut for finishing crack-free surface. Milling is performed to machine micro grooves with a ball end mill inclined at 45 degrees in the feed direction. The surface finishes on m plane are observed with changing the spindle speed, the feed rate and the feed direction. The surface finished in the feed direction perpendicular to c-axis is better than that of the feed direction parallel to c-axis with reducing adhesion of material. The surface finish also depends on the feed rate. In order to remove adhesion of removed materials, the surface should be finally finished in a small depth of cut.
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