Average power handling capability of thin‐film microstrip line under dc‐bias conditions

Abstract

AbstractAverage power handling capability (APHC) of the thin‐film microstrip line (TFML) under dc‐bias conditions (<1 V) is proposed for the first time. The TFMLs with a 20‐μm‐thick polyimide thin films are fabricated on a low‐resistivity silicon substrate (ρ ≤ 10 Ω cm). Losses and APHC are extracted from the measured S‐parameters up to 50 GHz. This study has also been studied on the different roughness and thermal conductivity of the polyimide film to evaluate the APHC of the dc‐biased TFML. It is believed that the evaluations are useful for the high‐dense microwave monolithic integrated circuits. © 2010 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:84–87, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.25653