Abstract
Industrial bonding technologies, including soldering and brazing, operate on solid-liquid phase boundaries. Commonly applied in many areas of industry (such as electronics, metallurgy or aviation), these bonding processes rely on the wetting of joining surfaces using a liquid bonding material. Understanding the wetting process and quantitative description of its parameters enables the design of new materials and joining technologies, as well as the optimization of existing methods. From the primary interfacial impact parameters, i.e. the contact angle and surface tension, the dynamics of the wetting process can be determined, including adhesive tension. This article investigates two independent measurement systems for wetting parameters in industrial brazing technologies: the sessile drop method and the Wilhelmy plate method. Both methods can be applied effectively in research on wetting processes. The measurement systems are compared in an example study.
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