Abstract
Abstract A technology file for the Magic layout editor has been developed to show the possibility of a design route which uses a CAD package not intended for hybrids, and as such it is considered to be a low cost approach to thick film CAD. Layout with design rule checking of multilayer hybrid circuits may be performed, consisting of two (or more) different metallization patterns with the possibility of using up to eight different resistor pastes, dielectrics, protective coating and solder paste. The thick film technology described is not meant to be indicative of good industrial practice, since the intention is to show how the technology file may be altered. The alterations performed provide for automatic resistor generation, device placement and automatic routing techniques in thick film circuits. Also, in single-layer technology, dielectric tiles are automatically created at metal crossings when an electric contact is not desired.
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