Automated void detection in high resolution x-ray printed circuit boards (PCBs) images with deep segmentation neural network

Abstract

Defect detection and quantification on printed circuit board (PCB) assemblies are crucial for ensuring the quality of electronic products. X-ray inspection is commonly used to detect internal defects, in which high-resolution gray-scale images are captured to reveal the internal structure, particularly the defect features, of an assembled PCB. To detect defect features, conventional computer vision techniques require hand-crafted feature filters and usually have a narrow application scope. This study introduces an automated method for detecting voids using supervised machine learning. The method employs end-to-end segmentation models to identify pixels that belong to the void and integrated circuit (IC) regions in X-ray PCB images. The segmentation results are then used to compute the percentage of voids within each IC, which is a key measure of the quality of the inspected PCB. Accurate predictions with an intersection over union of over 0.95 have achieved. A challenge in this development is the large size of the images, which can reach to millions of pixels, and the small scale of defect features. Training a deep segmentation model for large-scale images using conventional methods requires a lot of memory. Downscaling high-resolution images result in the loss of defect features. In this study, a unique training method utilizing the local nature of the defects is proposed, which reduces memory consumption and speeds up the training process. Additionally, to overcome the limited training data, various augmentation methods are applied and transfer learning is employed to construct segmentation models for different types of PCBs.