Automated Pose Measurement Method Based on Multivision and Sensor Collaboration for Slice Microdevice

Abstract

In this article, an automated method based on the multivision and sensor collaboration is proposed to achieve the precision pose measurement of microdevice with a slice micropart embedded inside. This method consists of three modules. First, the invisible attitude component measurement module based on a laser range sensor and the top view is designed to acquire the initial attitude component determined by the inside slice micropart. Second, the attitude component measurement module based on the contour primitives of interest extraction method abbreviated as contour primitives of interest extraction (CPIE) is utilized to obtain the other attitude components by extracting features from images directly. Third, an attitude controller based on the multivision is presented to achieve automated attitude component restriction ensuring that an exact attitude can be obtained when occlusion occurred. A series of experiments including entire assembly experiments are conducted and experimental results reveal that the proposed methods are effective and the attitude error is less than 0.6° meeting the requirement of assembly.