Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy

Abstract

Failure analysis of microelectronics is essential to identify the root cause of a device's failure and prevent future failures. This process often requires removing material from the device sample to reach the region of interest, which can be done through various destructive methods, such as mechanical polishing, chemical etching, focused ion beam milling, and laser machining. Among these, laser machining offers a unique combination of speed, precision, and controllability to achieve a high-throughput, highly targeted material removal. In using lasers for processing of microelectronic samples, a much-desired capability is automated endpointing which is crucial for minimizing manual checks and improving the overall process throughput. In this paper, we propose to integrate laser-induced breakdown spectroscopy (LIBS), as a fast and high-precision material detection and process control means, into an ultrashort pulsed laser machining system, to enable vertical endpointing for sample preparation and failure analysis of microelectronics. The capabilities of the proposed system have been demonstrated through several sample processing examples.