Abstract
AbstractGold/nickel thin films heat treated in the temperature range 200–500°C, have been analysed for composition–depth profiles using Auger electron spectroscopy in combination with simultaneous Ar+ ion sputtering. The present investigation indicates that pronounced nickel diffusion through the gold layer takes place due to annealing at 500°C for 5 min, whereas a noticeable nickel diffusion through the gold layer needs 3 h of annealing at 200°C. The measured concentration profiles suggest diffusion mechanisms involving infinitely fast grain boundary diffusion coupled with defect‐enhanced diffusion into the grains. Copyright © 2002 John Wiley & Sons, Ltd.
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