Abstract
Thin layers are widely used in electronics and protective coatings. They are also increasingly used in wearable electronics. A major challenge affecting the use of thin layers is their connection to flexible substrates, particularly textile products. This article describes the stability of the resistance of a silver layer with a thickness of 250 nm in a wide temperature range of 15–295 K. The aim was to determine the temperature dependence of the resistance of layers formed on a composite textile substrate compared with that of layers produced on an Al2O3 substrate. The results showed that the electrical parameters of the layer formed on the composite textile substrate changed in a manner atypical for metallic layers. This may have been due to the polyurethane base layer. The roughness and ability to deform under the influence of heat of the substrate can significantly affect the electrical parameters of a thin metal layer produced by the PVD coating process, which is important for the design of textronic applications.
Highlights
Thin layers are used widely in engineering to improve the surface properties of solids, such as abrasion resistance, corrosion resistance, reflectance, hardness, and absorption [1]
The coating material is heated with the evaporation source to a high temperature until a sufficiently high vapor pressure is achieved to reach the desired evaporation rate
This article deals with the influence of glued, riveted, and soldered joints between thin-layer structures produced on a textile substrate, which can be combined with other textile products and other elements of electronic systems
Summary
Thin layers are used widely in engineering to improve the surface properties of solids, such as abrasion resistance, corrosion resistance, reflectance, hardness, and absorption [1]. Praveen and coworkers [25] described a method of connecting leads to thin Cu2O layers on an ITO layer deposited on a glass substrate This structure was used to produce a gas sensor. During the production of thin-film structures on textile substrates and in application research, we observed unusual changes in the resistance of the produced layers, not previously described in the literature. This article deals with the influence of glued, riveted, and soldered joints between thin-layer structures produced on a textile substrate, which can be combined with other textile products and other elements of electronic systems This problem has not been described in the literature so far. We examined the effect of the textile substrate on the resistance of the layers
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