Abstract
A molecular dynamics method is used to simulate microcrack healing duringheating or under compressive stress. A centre microcrack in Al crystal could besealed by a critical compressive stress or by heating over a criticaltemperature. During microcrack healing, dislocation generation and motionoccurred. When there were pre-existing dislocations around the microcrack, thecritical temperature necessary for microcrack healing would decrease from 850 to650 K. The critical temperature necessary for microcrack healing depended uponthe orientation of the crack plane. For example, the critical temperature of thecrack along the (111) plane was the lowest.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Modelling and Simulation in Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
