Abstract
Atomistic computer simulations based on the binary collision approximation (BCA) are very well suited to predict the dependence of as-implanted dopant profiles on implant parameters like energy, dose and direction of incidence as well as on the arrangement of oxide, poly-Si and other materials on the single-crystalline Si substrate. In particular channeling effects, the enhanced dechanneling due to accumulation of radiation defects during ion bombardment and due to pre-existing ion-beam-induced defects can be simulated in a reasonable manner. The BCA code Crystal-TRIM was successfully integrated into 1D and 2D process simulators for the Si technology. The application of the trajectory splitting algorithm and the lateral duplication method ensures a high computational efficiency.
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