Abstract
Metal/Ceramic compounds show a wide range of applications, ranging from electronic packaging to bio-medical implants. A detailed knowledge of the bimaterial interface is therefore necessary in order to understand the compound properties and their dependence on microstructure and atomic configuration. In this study, thin overlayers of Cu on (0001) α-Al2O3 were grown by molecular beam epitaxy. The films possess a fixed (111)cu<110>cu ‖ (0001)s[1010]s (index S: Al2O3) orientation relationship to the substrate. High resolution transmission electron microscopy (HRTEM) and electron energy loss spectroscoppy (EELS) were applied to obtain information about the interface structure and the bonding mechanism of the interface at an atomic level. The HRTEM studies were performed on the Jeol JEM ARM 1250, an atomic resolution microscope operated at 1250 kV3. The bonding mechanism between Cu and Al2O3 can be determined by an analysis of the energy-loss near-edge structure (ELNES) of the internal interfaces. Those investigations were carried out in a VG HB501 dedicated scanning transmission electron microscope equipped with a parallel EELS (Gatan 666PEELS).
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Schedule a callMore From: Proceedings, annual meeting, Electron Microscopy Society of America
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