Abstract

AbstractPerovskite‐oxide‐based capacitors, which exhibit high charge storage capacity, have attracted considerable attention as a potential candidate for overcoming the limitations of nanoscale integration. Unfortunately, a dead layer forms in these capacitors at the interface between the electrode and the dielectric, which degrades the charge storage capacity; thus, this layer has been extensively investigated. The dead layer in perovskite‐oxide‐based capacitors exhibits different characteristics depending on the electrode materials; however, a method for minimizing this layer is lacking. In this study, the charge storage capacity of a perovskite‐oxide‐based capacitor is evaluated considering the effect of the Ru and SrRuO3 top electrodes on the SrRuO3/Ba0.5Sr0.5TiO3 stack. Dead layers at the interface between each top electrode material and the dielectric are studied on the atomic scale. The results indicate that the Ru metal electrode causes oxygen to diffuse from the dielectric to the electrode, forming elongated perovskite oxide at the interface, which acts as a dead layer. However, minimizing the dead layer at the top interface increases the dielectric permittivity from 667 to 953. Consequently, the phenomenon and mechanism of the dead layer are intuitively identified. This study proposes a method to overcome the limitations of next‐generation dynamic random access memory (DRAM).

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