Abstract
The interdiffusion and atomic structure of the interface between metallic glass Cu50Zr50 and crystalline Cu were investigated using molecular dynamics simulations. We show that the interdiffusion of atoms at the amorphous/crystalline interface is mainly manifested as the diffusion of crystalline Cu atoms into amorphous atoms, and only a very small amount of amorphous atoms diffuse into crystalline Cu. And the temperature and diffusion time are proportional to the thickness of the diffusion layer. The H-A bond index and Voronoi polyhedron distribution method were used to analyze the structure type and cluster distribution of the interface atoms. the results show that the diffusion will cause the amorphization of the atoms on the crystal side of the interface, and the higher the temperature and the longer the diffusion time, the higher the degree of amorphization of the interface atoms. And the size of the amorphized region is related to the temperature, and the dividing plane between the amorphized atoms and the crystal atoms gradually moves to the crystal side with the increase of temperature. In addition, the diffusion behavior of atoms at the amorphous/crystal interface with different crystal orientations exhibits anisotropy, and some atoms at the interface between the 〈110〉 oriented crystal and amorphous are transformed from FCC structure to HCP structure during the diffusion process.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.