Abstract
Atomic Layer Deposition (ALD) can be effectively used to deposit custom-designed, multi-material layers with atomic resolution on any micro- or nano-scale device surface. The nano-scale ALD coating can protect the devices from electrical short, charge accumulation, moisture-induced adhesion, wear, corrosion, creep, fatigue and anodic oxidation during short- term prototyping or long-term product life. Alternatively, ALD films can be lithographically defined in selected areas and micromachined to create ultra-thin nanoscale structures.
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