Atomic layer annealing for spatial tailoring in sub-4 nm AlN RRAM devices with low-voltage operation

Abstract

This article investigates the spatial tailoring of nitrogen vacancies by atomic layer annealing (ALA) on resistive random access memory (RRAM) devices with an AlN resistive switching layer. The ALA technique involves the in-situ layer-by-layer He/Ar plasma treatment in the cycle of atomic layer deposition for AlN. The AlN RRAM devices prepared with the ALA treatment near the TiN electrode have significantly superior uniformity of the operation voltages and the switching resistances, along with a lower cycle-to-cycle variation in endurance. This enhancement could be attributed to the relatively stable location of rupture and formation of conductive filaments, as a result of the film densification and the suppression of nitrogen vacancies in the AlN region treated with the ALA process. The AlN RRAM devices also demonstrate excellent retention of more than 106 seconds at 125°C. In addition, the ultra-thin 3.3 nm AlN switching layer contributes to low operation voltages of AlN RRAM. The outcomes manifest that the ALA technique could effectively improve the properties of nanoscale materials through precise spatial tailoring, with an accuracy up to atomic scale.