Abstract
AbstractMolecular dynamics simulations have been carried out to investigate the effect of philic‐phobic patterning and wettability contrast of biphilic (surface with interlaced hydrophilic and hydrophobic segments) surfaces on thin‐film evaporation and compare its performance with the surfaces with uniform wettability, ie, hydrophilic/hydrophobic. Thin liquid film of argon with 3 nm film thickness is placed over platinum surface. After equilibrating the system at 90 K, the temperature of the platinum wall is raised to two different temperatures 110 and 130 K to study the effect of wall superheat temperature. The results obtained in this study indicate that biphilic surface offers wall heat flux and evaporative mass flux close to the hydrophilic surface. With the decrease of philic‐phobic pattern bandwidth of biphilic and superbiphilic surface, the maximum value of evaporative mass flux and wall heat flux increases. Also higher wettability contrast among hydrophilic and hydrophobic region offers higher value of wall heat flux and evaporative mass flux. The boiling inception time decreases with the decrease of philic‐phobic pattern bandwidth and increase of wettability contrast therefore, the nonevaporating layer appears earlier in case of lower philic‐phobic pattern bandwidth and higher wettability contrast.
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