Abstract

Atomic deuterium and hydrogen adsorption on thin silver films deposited under UHV conditions on Pyrex glass was studied by means of measurements of the resistance changes Δ R combined with thermal desorption mass spectrometry (TDMS). The roughness factor of thin Ag films of known geometry, textured as a result of sintering, was determined by means of the BET method (xenon adsorption), while their preferential crystallographic orientation (1 1 1) was estimated on the basis of XRD data. Δ R measurements were performed during various exposures of the films maintained at a constant temperature (78 or 89 K) to the flux of atomic deuterium (hydrogen) of known concentration generated on a hot tungsten filament. Every adsorption run was followed by thermal desorption. This gives a link between the Δ R measured directly in the course of adsorption and the coverage Θ determined on the basis of TDMS data, together with the BET and XRD results. It was found that at 78 K the rate of atomic deuterium (hydrogen) adsorption and recombination on the surface of sintered thin Ag films fits the Eley–Rideal (ER) mechanism, while at 89 K its overlapping with the Langmuir–Hinshelwood (LH) recombination starts to play a role. The initial sticking probability reaches 0.41 and 0.65 for D and H atoms, respectively, while the corresponding probabilities for recombination are 0.04 and 0.07. The activation energies for associative desorption of deuterium and hydrogen are 36 and 29 kJ/mol, respectively.

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