Abstract

Lithography is a top-down technology to produce sub-micrometer feature sizes for the fundamental research and widespread applications. The conventional optical lithography has been developed to not only make the tiny electronic devices to form the basic circuits in today’s computer chips, but also fabricate micro/nano electromechanical systems (MEMS/NEMS). However, the conventional photolithographic techniques have now reached their ultimate spatial resolution because of both the light diffraction and the photoresist restrictions [1]. Alternative techniques for traditional photolithography have been proposed and developed to meet the requirements of a high spatial resolution of sub100 nm as well as the capability to fabricate an arbitrary structure and achieve mass production [1-10]. Research teams around the word have been investigating alternative techniques including extreme ultraviolet lithography, electron and ion beam lithography, Xray lithography and atom lithography. Each technique has its own advantages and disadvantages, and no one yet knows which one will be the method of choice for the next generation lithography (NGL). The arrays of microand nanostructures fabricated on silicon substrates have now attracted more attention for its interesting characteristics in applications such as photonics, electronics, optoelectronics and sensing [11-15]. The array properties can be tuned further by varying the geometry, the doping, the periodicity, and the size of the microand nanostructures [11,12]. These controllable and elaborate arrays are commonly fabricated by conventional optical lithography, X-ray lithography, electron-beam or ion-beam lithography [1,16-18]. Unfortunately, there are inherent limitations to pattern over large areas at nanoscale using these lithographical techniques due to the light diffraction, the long-range inter-particle interactions and the proximity effects. To overcome these limitations, it’s necessary to develop new alternative techniques with a shorter wavelength and a thinner resist for traditional optical lithography. Among the alternative techniques for traditional photolithography, atom lithography based on metastable atoms beam (MAB) and self-assembled monolayers (SAMs) has shown significant potential in fabricating arrays of microand nanostructures, which is a major goal in nanoscience and nanotechnology [10,19-29]. Metastable atom is one of the atom’s electron is

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