Abstract

Multimaterial, microelectromechanical systems-based cantilever probes were developed for high-frequency magnetic field imaging. The basic configuration of the probe consists of a cantilever beam fabricated using surface micromachining and bulk micromachining techniques with dielectric silicon nitride and silicon oxide materials on a silicon wafer. A gold patterned metallization at the tip of the cantilever provides a source of eddy current heating due to the perpendicular component of the high-frequency magnetic field. This thermally absorbed power is converted to mechanical deflection by a multimaterial trilayer cantilever system. The deflection is measured with a beam-bounce optical technique employed in atomic force microscopy systems. We discuss the modeling, design, fabrication, and characterization of these field imaging probes

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call