Abstract
This paper presents the analysis of information collected from numerous patent searches on lead‐free alloys. The significance of claim structure and content is discussed in view of the growing number of lead‐free patents. Patent analysis software was developed to effectively compare over 350 lead‐free alloy patents. A case study was conducted to assess Sn‐Ag‐Cu and special purpose lead‐free candidate alloy intellectual property. The results show that there are a number of patents and patent applications that may affect the use of “popular” Sn‐Ag‐Cu formulations.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
