Assembly technology of 4-side buttable MPPC

Abstract

The multi-pixel photon counter (MPPC) is a solid-state photon counting device consisting of a Geiger-mode APD and a quenching resistor. Through-silicon via technology (TSV) allows for the production of a discrete array version of the MPPC, creating a detector with the advantages of a larger active area and less dead space in its overall packaging when compared to other package types commonly used to produce MPPCs. Eliminating the need for a wire-bonding pad allows individual MPPCs to be tiled with minimum dead-space between individual detectors to form a four-sided buttable array. Selecting MPPCs that behave and perform very similarly to each other, especially when an operating voltage is applied, minimizes variation in performance between each channel and enhances channel uniformity. The output of discrete arrays of MPPCs can be easily readout with ASICs (application specific integrated circuits) due to their excellent channel uniformity characteristics, with minimum adjustment required by the ASIC.