Abstract
Just in few years, three-dimensional (3D) packaging technologies have attracted much more attention. With the development of through-silicon via (TSV) technology, silicon-based device integrations have become the main stream of 3D packaging technologies. In this study, the assembly of high performance processor chip and TSV interposer is developed. From bottom to top assembly process was applied and the warpage of the interposer was effectively suppressed. Flying-Probe testing showed a good conducting of the package.
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