Assembling Isostructural Metal‐Organic Coordination Architectures on Cu(100), Ag(100) and Ag(111) Substrates

Abstract

Isostructural coordination architectures in two dimensions on different substrates require sufficient metal-organic bonding strength to overcome templating effects from the surface. The network structure in this STM image was grown on Cu(100) and was also produced on Ag(111) and Ag(100) surfaces, due to robust three-fold NCu coordination interactions stabilizing the network. Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.